Fine gold or aluminium wire for making electrical interconnection in hybrid circuits between various bonding pads on the semiconductor device substrate and device terminals or substrate land.
tiny gold or less commonly aluminum wires that form connections from bond pads to lead frames. Common gold bond wire is 1 to 3 thousands of an inch in diameter, aluminum bond wire is used for thicker wires such as 5 or 7 thousands of an inch.
Wire connect between whirlpool auxilliary control and pump.
Fine gold or aluminum wire for making electrical connections in monolithic or hybrid circuits between various bonding pads on the semiconductor substrate and device terminals or substrate lands.