Cutting up the wafer into individual chips. This is usually done with a circular saw called a dicing saw.
(See also die, below.) The action of slicing a silicon wafer into its respective parts called die. The picture shows a wafer on the left which, after dicing, is cut into four die (on right). Due to the precision needed for such a feat, a special saw, similar to a circular saw only with a blade approximately 2 inches in diameter, is used for dicing silicon.
Process of cutting silicon die into squares or rectangles.
Dicing is a method of food preparation in which the food item is cut into small blocks or dice. This may be done for aesthetic, or artistic, reasons or to create uniformly sized pieces to ensure even cooking. Dicing is a desirable method of food preparation, due to the small nature of the pieces of food, which allows the spread of flavour and texture throughout the dish.