A mixture of solder powder, flux, solvents and binder that is screen printed onto the printed circuit board and then reflowed to form the solder joints.
Reflowable pre-mixed solder paste that is printed and formed into a solder sphere. Provides the electrical connection between the die and the package substrate or printed circuit board. Since it is premixed, it provides for excellent composition control. Typically made up of two to four metals.
A homogeneous combination of minute spherical solder particles, flux, solvent, and a gelling or suspension agent, which has the consistency and viscosity of a paste and is used in surface mount reflow soldering. Solder paste can be deposited on a substrate by solder dispensing and screen or stencil printing.
Solder paste (or solder cream) is a mix of small solder particles and flux. It is used extensively in the automated soldering processes wave soldering and reflow soldering.