Process whereby moulded CDs are coated in aluminium
A process for coating molded CD s with aluminum whereby an aluminum target is bombarded with particles causing the aluminum to be deposited on the CD surface. Sputtering is also used to deposit Gold or Silicon on the semi-reflective layer of dual layer DVD-9 discs.
A process for coating moulded CDs with aluminium whereby an aluminium target is bombarded with particles causing the aluminium to be deposited on the CD surface. Sputtering is also used to deposit Gold or Silicon on the semi-reflective layer of dual layer DVD-9 discs.
The application of a magnetic layer without a binder by means of ionic bombardment in a vacuum.
Occurs when the electrode in a neon tube, because of the heat and electrical forces, gradually erodes, blackening the ends of the tube near the electrode and decreasing gas pressure, eventually making the tube inoperative.
Is a method better known as "vacuuming" to apply coating on the glass.
It is a process which uses the ions of an inert gas for atoms dislodgement from the surface of a crystalline material. The atoms are then electrically deposited to form an extremely thin coating on a glass, metal, plastic, or other surface.
(sc) a method of depositing a thin film of material on wafer surfaces. A target of the desired material is bombarded with radio frequency-excited ions which knock atoms from the target; the dislodged target material deposits on the wafer surface.
1. The ejection of atoms or groups of atoms from the surface of the cathode (negative electrode) of a vacuum tube as the result of heavy-ion impact. 2. The use of this process to deposit a thin layer of metal on a glass, plastic, metal, or other surface in a vacuum.
A form of physical vapor deposition (PVD) often used for deposition of metal films.Sputtering involves knocking metal atoms off a disc of pure metal with charged, energetic, chemically inactive atoms called ions (from a plasma). The metal atoms will re-deposit onto the wafer to build up the desired metal film.
A vacuum method of depositing a very consistent thin magnetic film on substrate surfaces.
This is a glow discharge process whereby bombardment of a cathode releases atoms from the surface which then deposit onto a nearby target surface to form a coating.
a process used to deposit materials where a plasma is used to generate ions, the ions are attracted to a target, the ions impact the target and physically knock loose target atoms, and the atoms knocked loose condense out on wafers placed in the chamber depositing a film. Sputtering is primarily used to deposit metal films. Sputtering is preferred over evaporation because sputtering will transfer a metal alloy from a target to a wafer with roughly the same composition on the wafer as in the target. Evaporation deposits elements at different rates depending on vapor pressure so the film on the wafer may not match the composition of the target. See also, tech brief on Sputtering.
A coating process whereby thermally emitted electrons collide with inert gas atoms, which accelerate toward and impact a negatively charged electrode that is a target of the coating material. The impacting ions dislodge atoms of the target material, which are in turn projected to and deposited on the substrate to form the coating.
A metal coating process for the glasses surface.
A process used to apply photovoltaic semi-conductor material to a substrate by a physical vapor deposition process where high-energy ions are used to bombard elemental sources of semiconductor material, which eject vapors of atoms that are then deposited in thin layers on a substrate.
Sputtering is a physical process whereby atoms in a solid target material are ejected into the gas phase due to bombardment of the material by energetic ions. It is commonly used for thin-film deposition, as well as analytical techniques (see below).