(TAB) A method for establishing an electrical interconnection between a die and a substrate through use of conductors on beam tape that are mass-bonded to bumps on the integrated circuit in a single operation.

The process where silicon chips are joined to patterned metal on polymer tape (e.g., copper on polymide), using thermocompression bonding, and subsequently attached to a substrate or board by outer lead bonding. Intermediate processing may be carried out in strip form through operations such as testing, encapsulation, burn-in, and excising the individual packages from the tape.

metal conductors mounted to Mylar tape, bonded to gold bumps on die. The Mylar tape is held on reels and TAB bonded die may be automatically placed onto PC boards very efficiently.