(ICT) Test procedure in which circuit nodes of an assembly are accessed by pin-type probes to test individual components within the circuit.
electrical test of individual component or part of the circuit board instead of testing the whole circuit.
Combination of hardware and software that identifies manufacturing induced faults of printed circuit board assemblies (PCBAs) by isolating and individually testing devices using a bed-of-nails fixture. Potential faults include shorts, opens, wrong components, missing components, etc.
The individual electrical test of each component of a PCB assembly, even if many components are soldered to the PCB.