A generic name for a group of advanced interconnection and packaging technologies featuring unpackaged integrated circuits mounted directly onto a common substrate.

multichip module: 2 or more die are attached to the same substrate and wire bonded

A type of integrated-circuit packaging configuration.

Multichip Module. Multichip modules consist of multiple bare IC chips mounted directly on a substrate, often quite similar to a small printed wiring board. This MCM can then be coated for protection from moisture and other hazards and used as is or is mounted on another printed wiring board as part of a larger printed wiring assibly.

ultichip odule. A collection of more than one bare die or micropackage on a common substrate. Typically enclosed.

Multi Chip Modules.

Multichip Module. A circuit comprised of two or more silicon devices bonded directly to a substrate by wire bond, TAB or flip chip.

Multi-Chip Module

A type of board technology whereby multiple, unpackaged integrated circuits (bare die) are mounted — along with signal conditioning or support circuitry such as capacitors and resistors — on a single laminate or ceramic base material. The MCM footprint is much smaller than conventional single chip packages, resulting in a smaller motherboard and smaller space requirements for panels, enclosures, and cabling. The result is a high-density module that resembles a single component when mounted on a printed circuit board. By combining more circuit functions in an MCM, fewer system assemblies are required, resulting in lower circuit design costs, integrated functional testing, and higher manufacturing yields. Measling