A generic name for a group of advanced interconnection and packaging technologies featuring unpackaged integrated circuits mounted directly onto a common substrate.

A hybrid which contain at least two bare die.

A module, or package, capable of supporting several chips on a single substrate. MCMs are differentiated from ‘hybrids' by having a high ratio of active silicon to substrate area. MCM-L = laminate construction, MCM-D = dielectric layer construction. MCM-C = ceramic substrate construction.

A microcircuit consisting solely of active dice and passive chips which are separately attached to the major substrate and interconnected to form the circuit.

(MCM) A packaging approach based on the interconnection of multiple bare die on a single substrate.

Two or more die are attached to the same substrate and wire bonded.

A module capable of supporting several ICs in a single package. Typically, multichip modules are based on ceramic, contain high performance ICs with high pin count, and use some form of advanced interconnect technology such as TAB, COB, or C-4. The parameters used to define a multichip module are vague, but one basic criterion is a package that is no less that 20% silicon, has no fewer that 100 I/O on a substrate, and has no fewer that four layers.

A package that contains several chips on a substrate.