(sc) 1) the deposition of a thin film pattern of conductive material onto a substrate to provide interconnection of electronic components or to provide conductive contacts. 2) the layer of high-conductivity metal used to interconnect devices on a chip. Aluminum is commonly used.

The deposition of a thin film of conductive material on to a wafer or substrate by use of either chemical or physical vapor deposition.

A semiconductor manufacturing process in which a layer of metal, such as aluminum, is placed on the wafer to connect the transistors and diodes within an integrated circuit.

a layer of metal typically utilized to interconnect different devices that make up an integrated circuit.

the metal pattern deposited on the sensor chip (usually outside the diaphragm area) to permit electrical connections to be made to the chip. Aluminum is usually used, but has potential contamination problems (known as the "purple plague"), if not protected. MICRO SWITCH uses gold, which is impervious to almost everything.