A thin, precision metal stamping that connects the wiring from tiny electrical terminals on the semiconductor surface to the large-scale circuitry on electrical devices and circuit boards. Leadframes are used in almost all semiconductor packages.
a metal frame that usually includes a paddle that supports an IC die that has been cut from the wafer
(L/F) Sheet metal framework upon which an integrated circuit is attached.
A metallic frame used for mounting and connecting LED chips. The leadframe functions as the electrical leads of the device.
A metal frame, connected to the bonding pads of the chip by lead, that provides electrical connection to external points.
A stamped or etched metal frame, provides external electrical connections to a packaged electronic device.
the Metal frame that Semiconductors are attached to during the Package Assembly process. Typically a Leadframe is a long Metal frame with positions for multiple Chips. After the Chips are attached to the Leadframe tiny wire are used to connect the Chip Bond Pads to the frame and then the positions on the frame where Chips are located are encapsulated in epoxy. After Molding the encapsulated Chips are mechanically broken loose from the frame rails and the parts of the frame protruding from the Package become the Package leads.