A process or the result of a process for making electronic components of higher density than normal printed circuit board technology. Since hybridizing electronics can be more expensive than discrete circuitry it is only used when space is at a premium as in the sensing head electronics of an infrared system.

A component in a relatively large package that contains other parts mounted on a substrate.

A microcircuit consisting of two or more physically separate electronic components (ICs, discrete transistors, resistors, capacitors, inductors, etc), mounted on a single interconnecting substrate and packaged in a similar fashion to individual integrated circuits. Recently, hybrids made mostly from ICs and built on silicon, ceramic, and fiberglass substrates have been called multichip modules or MCMs.

An electronic sub-system in which a number of integrated circuits (packaged and/or unpackaged) and discrete components are attached directly to a common substrate. Connections between the components are formed on the surface of the substrate, and some components such as resistors and inductors may be fabricated directly onto the substrate.

See echo-producing circuit.

A TVSS design that utilizes both SADs and MOVs in the same circuit.

A method of interconnecting, assembling, and manufacturing electronic circuits in one package by using more than one discrete chip in combination with thick or thin film components formed on the substrate.