A mounting approach in which the chip is inverted and connected directly to the substrate rather than using the more common wire bonding technique.
An integrated circuit which is designed to electrically and mechanically interconnect by means of an appropriate number of bumps and is intended for facedown mounting.
A â€˜Chip-On-Boardâ€™ technology in which the silicon chip is inverted (â€˜flippedâ€™) and interconnected mechanically and electrically to a conductor pattern on the substrate by conductive bumps on the chip. The bumps are formed on the active surface of the chip, which is turned over for attachment. Flip-chip bumps are usually of solder, deposited on the bonding pads in vacuum, then reflowed. This process needs complex metallisation on the bonding pads. Originally developed by IBM, the process is also known as C4 (controlled collapse chip connection).
Semiconductor die, inverted and mounted directly to printed circuit board pads. Solder is subsequently deposited on pads. This technology is called a chip-on-board technique, or controlled collapse chip connection (C4).
A method of attaching a silicon chip in which the bonding pads and circuit are placed face down to contact pads on the substrate.
A leadless monolithic structure, containing circuit elements, which is designed to electrically and mechanically interconnect to the hybrid circuit by means of an appropriate number of bumps located on its face which are covered with a conductive bonding agent.
A chip that has bumped termination spaced on the face of the device and is designed for face-down mounting.
A method for electrically interconnecting unpackaged die active side down with a conductive bump to the substrate.