A method for electrically interconnecting unpackaged die active side down with a conductive bump to the substrate
A leadless structure that is electrically and mechanically connected to the substrate via contact lands or solder bumps.
Flip chip interconnect technology pertains to the mounting of a chip with its active side facing the substrate.
Unpackaged silicon dies that have been supplied with solder balls directly on the active side of the die. They are called flip chips because they are flipped upside-down, compared to a conventional wirebonded chip.
A die that has bumps to create the electrical connection between the die and the board. So called because the die has to be flipped over in order to be assembled.
Type of BGA package which uses an array of solder bumps on the bottom of the semiconductor chip to connect the chip to the balls on the bottom of the package.
Microchip design developed by Intel for its faster microprocessors in which the hottest part of the chip is located on the side that is away from the motherboard.
another name for a bumped die. Bumped die are flipped over to solder them down, hence the name flip chip.
COB technology that has bumps attached to the silicon die, is flipped, and mounted directly to a printed circuit board.
A flip chip is one type of mounting used for semiconductor devices, such as IC chips, which does not require any wire bonds. Instead the final wafer processing step deposits solder bumps on the chip pads. After cutting the wafer into individual dice, the "flip chip" is then mounted upside down in/on the package and the solder reflowed.
Flip-ChipÂ® modules were used in the DEC PDP-7 (Referred to in documentation as the "FLIP CHIP"), PDP-8, PDP-9 and PDP-10, beginning on August 24, 1964.