A multi-contact SMT device soldered to a circuit board with solder balls.
(BGA) Type of chip package. An integrated circuit surface-mountpackage with an area array of solder balls that are attached to the bottom side of a substrate with routing layers.
an integrated circuit surface mount package with an area array of solder balls that are attached to the bottom side of a substrate with routing layers. The die are attached to the substrate using die and wire bonding or flip-chip interconnection. Also called land grid array, pad grid array, or pad-array carrier.
A package that has its I/Os, made with solder bumps, across the whole of the surface area rather than just the periphery. Therefore, an area array of solder balls joined to a SCM or MCM is used to electrically and physically connect the package to the next level of package, usually a printed circuit board.
A packaging technology similar to a pad grid array, in which a device's external connections are arranged as an array of conducting pads on the base of the package. However, in the case of a ball grid array, small balls of solder are attached to the conducting pads.
An IC package with an array of spherical balls used to electrically attach to the Printed Circuit Board.
As opposed to a pin grid array, a ball grid array is a type of microchip connection methodology. Ball grid array chips typically use a group of solder dots or, balls, arranged in concentric rectangles to connect to a circuit board. BGA chips are often used in mobile applications where PGA chips would take up too much space due to the length of the pins used to connect the chips to the circuit board.
A SMD package in which solder ball interconnects cover the bottom surface of the package.
a newer type of package for IC's with very high pin counts. Replaces pin with small solder balls.
A type of memory chip with solder balls on the underside for mounting. Use of BGA allows die package size to be reduced because there is more surface area for attachment. Smaller packaging allows more components to be mounted on a module, making greater densities available. The smaller package also improves heat dissipation for better performance. See CSP and FBGA.
Surface mount technology IC package that provides electrical advantage of shorter signal and power paths and the mechanical advantage of greater interconnects and higher lead pitch, while decreasing package size.
BGA is descended from pin grid array (PGA), which is a package with one face covered (or partially covered) with pins in a grid pattern. The pins are used to conduct electrical signals from the integrated circuit to the printed circuit board (PCB) it is placed on. In a BGA, the pins are replaced by balls of solder stuck to the bottom of the package. The device is placed on a PCB that carries copper pads in a pattern that matches the solder balls. The assembly is then heated, causing the solder balls to melt. Surface tension causes the molten solder to hold the package in alignment with the circuit board, at the correct separation distance, while the solder cools and solidifies.
A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits.