Thin Small Outline Package (casing)
Thin Small Outline Package - a common plastic package for IC's, particularly memory.
(Thin Small-Outline Package) - A DRAM package that uses gull-wing leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The TSOP package is one-third the thickness of an SOJ. TSOP components commonly occur in small-outline DIMMs and credit card memory.
One of several packaging options for AMD flash devices.
Thin small outline package. It is thinner and slightly smaller than an SOJ, with gullwing-shaped leads. A thin, rectangular package with leads sticking out the sides of the package.
Thin Small Outline Package. An integrated circuit SMT package with two parallel rows of 20 to 48 gull-wing leads. The pitch is 20 mils.
see Thin Small Outline Package
Thin Small Outline Package - This bios chip on the motherboard can be flashed with a hacked bios as a cheap alternative to a modchip. Switches can even be installed. This can be dangerous and difficult. I prefer the modchip installation to leave the TSOP untouched.