An intermediate stage in the reaction of a thermosetting resin in which the material softens when heated and swells when in contact with certain liquids but does not entirely fuse or dissolve. Materials are usually precured to this stage to facilitate handling and processing prior to final cure. (Sometimes referred to as resitol.)
Also referred to as "prepreg." Sii-cured stage of base printed wiring board substrate. B-stage material is used in lamination. During the lamination cycle, the B-stage is cured to C-stage.
This describes an intermediate stage of reaction where the material will soften when heated and swells in the presence of certain liquids, but may not completely fuse or dissolve. The resin is usually supplied in this uncured form.
A partially cured resin or prepreg product
The intermediate stage during the curing process when the material has gelled but is not fully cured.
An intermediate stage in the reaction of certain thermosetting resins in which the material softens when heated and is plastic and fusible but may not entirely dissolve or fuse; sometimes referred to as resistol. The resin in an uncured prepreg or premix is usually in this stage.
An intermediate stage in the reaction of certain thermosetting resins in which the material swells when in contact with certain liquids and softens when heated, but may not entirely dissolve or fuse; sometimes referred to as resistol. The resin is an uncured prepreg or premix is usually in this stage.
The intermediate stage in the reaction of certain thermosetting polymers wherein the material can still be softened when heated or swelled in contact with certain liquids but cannot be completely fused or dissolved; B-staged resins generally permit some degree of formability or shaping into certain specific configurations.
Intermediate stage in the polymerization reaction of thermosets, following which material will soften with heat and is plastic and fusible. Also called resistal. The resin of an uncured prepreg or premix is usually in B-stage. See A-Stage and B-Stage.
An intermediate stage (between the A-stage and the C-stage) in the reaction of certain thermosetting resins in which the material softens when heated and swells when in contact with certain liquids.
An intermediate stage in the reaction of a thermosetting resin in which the material softens when heated and swells in contact with certain liquids but does not entirely fuse or dissolve. Resins in thermosetting moulding compounds are usually in this stage. See also A-Stage and C-Stage.
Intermediate stage of curing. Not yet fully cured. Will not flow, but will yield to pressure.
A partially cured thermosetting adhesive used in multiplayer boards. During lamination, the application of heat and pressure completes the curing process.
An intermediate stage in the reaction of certain thermosetting resins in which the material softens when heated and swells when in contact with certain liquids, but may not entirely fuse or dissolve. The resin in an uncured thermosetting system, is usually in this stage.
Also called resistal. Intermediate stage in the polymerization reaction of thermosets. After B-stage, material softens with heat and is plastic and fusible. The resin of an uncured prepreg or premix is usually B-stage. See A-stage, C-stage.