metal heat radiators designed to remove heat components, particularly power transistors, by thermal conduction, convection or radiation. Heat is conducted away from the internal junction of a semiconductor device to a surface where it can be dissipated. It can be a finned aluminum extrusion, finned copper, or aluminum stampings located under the device case, or aluminum extrusions with radiating fins that clip on the device case. A chamber that is cooled by circulating fluid can also be a heatsink.
A aluminum, or sometimes copper block of metal used to aid in cooling processors or RAM. It is connected on top of the chip and helps cooling by absorbing heat from the processor and diffusing faster through its increased surface area. Heatsinks are designed for maximum surface area, because this allows the air to absorb more heat. Most computers use a heatsink and fan combination for maximum air flow/cooling.
This is a device that contacts a microprocessor (or other object in need of cooling) and removes heat by exchanging it with air in a more efficient manner than the flat surface the heatsink is attached to. The heatsink does this by providing more surface area than a flat surface.
A heat sink usually consists of a metal structure with one or more flat surfaces to ensure good thermal contact with the components to be cooled, and an array of comb or fin like protrusions to increase the surface contact with the air, and thus the rate of heat dissipation. A heat sink is often used in conjunction with a fan in order to increase the rate of airflow over the heat sink, thus maintaining a larger temperature gradient by replacing warmed air faster than would be by convection, this is known as a forced air system.