a device that attaches to a microprocessor to keep it from overheating by absorbing its heat and dissipating it into the air

a device that is attached to a microprocessor chip to keep it from overheating

a device that looks something like a bed of nails that wicks the heat into its tines, where the airflow removes it

a device (usually a block

a specially shaped piece of metal, with a base and fins, designed so that the fins can provide the maximum possible surface area for heat dissipation

CPU component designed to dissipate heat. Some work with the help of a fan.

metal heat radiators designed to remove heat components, particularly power transistors, by thermal conduction, convection or radiation. Heat is conducted away from the internal junction of a semiconductor device to a surface where it can be dissipated. It can be a finned aluminum extrusion, finned copper, or aluminum stampings located under the device case, or aluminum extrusions with radiating fins that clip on the device case. A chamber that is cooled by circulating fluid can also be a heatsink.

A aluminum, or sometimes copper block of metal used to aid in cooling processors or RAM. It is connected on top of the chip and helps cooling by absorbing heat from the processor and diffusing faster through its increased surface area. Heatsinks are designed for maximum surface area, because this allows the air to absorb more heat. Most computers use a heatsink and fan combination for maximum air flow/cooling.

This is a device that contacts a microprocessor (or other object in need of cooling) and removes heat by exchanging it with air in a more efficient manner than the flat surface the heatsink is attached to. The heatsink does this by providing more surface area than a flat surface.

A heat sink usually consists of a metal structure with one or more flat surfaces to ensure good thermal contact with the components to be cooled, and an array of comb or fin like protrusions to increase the surface contact with the air, and thus the rate of heat dissipation. A heat sink is often used in conjunction with a fan in order to increase the rate of airflow over the heat sink, thus maintaining a larger temperature gradient by replacing warmed air faster than would be by convection, this is known as a forced air system.

Device used to conduct away and disperse the heat generated by electronic components.

A device that makes contact with a microprocessor (or other object in need of cooling) and removes heat by exchanging it with air in a more efficient manner...

Device used to transfer heat away from either an SCR or Diode.

A device for dissipating heat; it absorbs heat by conduction from heat producing devices and dissipates heat by means of convection.

A metal device that uses convection or forced air in order to cool processors and other components.

Metal device used to cool processors and other components by means of convection or forced air.