A piece of metal, generally consisting of rows of thin metal fins, which is used to dissipate heat away from electronic components.
An assembly that serves to dissipate, carry away, or radiate into the surrounding atmosphere heat that is generated by an active electronic device.
A device that aids in the removal of heat from electronic equipment, and is particularly important when heat is generated in a small area, or when devices such as power transistors, rectifiers and microprocessors are operated. Heat sinks may be added to components, or to complete assemblies. Typically they are made of metal with high thermal conductivity, and the removal of heat may be assisted by built-in fans as well as depending on natural or forced convection.
Facility to provide cooling of PAR and MSR components while "buttoned up" during a nuclear attack. Water for component cooling was re-circulated through an underground storage cavern where its heat was dumped. Photo (B20).
Good thermal conductor used to remove destructive heat from an area.
A structure, attached to or part of a semiconductor device that serves the purpose of dissipating heat to the surrounding environment; usually metallic and often aluminium.
A piece of heat conductive metal with cooling fins that can be attached to the top of an IC, such as a CPU, to draw heat away and allow it to run cooler.
a metal plate used to conduct heat away from electronic components
The area or media where heat is absorbed into.
It is a metallic heat exchanger which has been designed to absorb and dissipate the excess amount of heat from one of the devices, like a transistor or resistor in a circuit.
Metal structure made to absorb and then dissipate waste heat from an operating circuit
A milled piece of aluminum or other material bearing fins or fingers to increase surface area, and thus dissipate unwanted heat into the air more rapidly than a device with no heat sink attached.
Any device that absorbs and draws off heat from a hot object, thereby neutralizing the extreme temperature.
a metal conductor specially designed to conduct (and radiate) heat
a component that keeps the processor from overheating
a device that is attached to the hot side of thermoelectric module
a device that is either built onto or attached to a microprocessor chip to help keep the chip cool
a device, usually made of metal, brought into contact with the hot surface of a component, such as a microprocessor chip, in order to aid the cooling of that componentthrough thermal dissipation by conduction and convection
a device, usually made of metal, brought into contact with the hot surface of a component, such as a microprocessor chip , to help cool that component through thermal dissipation by conduction and convection
a device which absorbs or removes heat from a thermal system
a large metallic object that effectively increases the surface area of a component
a metal conductor designed to cool a component through thermal dissipation by conduc
a metal device that draws heat away from an electronic device
a metal plate with fins or spikes intended to dissipate heat
an environment or object capable of absorbing heat from another object with which it
a physical device, often seen in electronic circuits, to assist bulk heat dissipation by conduction and convection
a piece of metal with a grill shape that is stuck on a computer chip that gives off too much heat and would either fail or catch fire otherwise
a simple passive device but add a fan and it becomes an active device
a small set of metal fins, like the surface of a motorcycle engine, that fits onto the component
a structure including one or more portions and/or components for absorption, dissipation and/or removal of heat
Any device used primarily to absorb heat from, and thereby protect, another device from damage due to excessive heat.
A device for dissipating heat; it absorbs heat by conduction from heat producing devices and dissipates heat by means of convection. Heat sinks are common inside fire service thermal imagers to help maintain proper operating temperatures.
A metal mass with fins designed to absorb heat from a 'busy' and therefore hot device, eg the microprocessor in a PC, for which a small fan helps the process, and radiate this heat away safely into the ambient air.
A device that conducts and disperses heat commonly produced by electronic equipment and components.
A metal part with maximized surface areas designed to dissipate heat generated by electronic components.
A material used to absorb or draw heat away. In tempering for instance, a scrap of steel could be laid across a thin section of a blade to protect it from over-heating.
A device which possesses low thermal resistance in order to effectively transfer dissipated heat to the ambient temperature.
A substance or device used to dissipate or absorb unwanted heat energy.
Device used to conduct away and disperse the heat generated by electronic components .
Device to absorb heat from one medium and dissipate it.
A mass of metal attached to a chip carrier or socket for the purpose of dissipating heat.
Anything that absorbs heat. It is usually part of the environment, such as the air, a river, or a lake.
A structure or media that absorbs heat.
a phenomenon whereby cancerous tissue cools at different rates because of its distance from large blood vessels. A constant supply of warm blood circulating nearby and diffusing heat to the lesion can inhibit the freeze process.
A metal plate on some microprocessors that helps dissipate heat.
A metal plate with metal pegs or ribs that help dissipate heat. Some microprocessors include a heat sink.
Metal plate, extrusion, case, etc. used to transfer heat away from sensitive components and/or circuits. Also see Base Plate.
A block of metal fin used to cool down the chips within the computer.
A component, typically zinc alloy, that dissipates heat. CPUs require heat sinks.
Usually a metal plate, extrusion, etc. that is used to transfer heat away from sensitive components.
A substance or device that absorbs and dissipates unwanted heat generated by a process or an electronic device.
an area where a heat pump transfers the heat it takes from a "heat source." In an EES, the soil is a heat source when a home is being heated, and a heat sink when a home is being cooled.
1. Thermodynamic. A body which can absorb thermal energy. 2. Practical. A finned piece of metal used to dissipate the heat of solid state components mounted on it.
A device, typically made of aluminum or another conductive metal, to remove heat from a package and distribute it to the local environment.
Mass of metal that is attached to a device or component in order to dispurse heat.
A piece of metal with cooling fins that can be attached to or mounted on an integrated chip (such as the CPU) to dissipate heat.
The heat sink sits directly on the microprocessor (CPU) to dissipate the heat generated by the processing vibrations. Without the heat sink the CPU would have a meltdown.
a component generally made of aluminum or a zinc alloy and having fins designed to lower the temperature of an electronic device to which it is attached by dissipating heat into the surrounding air; most modern motherboards require either a heat sink, fan, or both.
Piece of metal that can be mounted to chips to dissipate heat.
A device used to remove heat from electronic components such as tubes, transistors and the like.
A device that lowers thermal impedance and helps to dissipate heat from within the package.
A surface used to dissipate heat. Metal mounting surface in electrical devices used to dissipate heat in the device, i.e., diode bridge, cpu fan base.
The structure through which thermal energy is transferred to an external cooling medium.
A device used to draw off (conduct away) heat. Usually pertains to a semiconductor device. A source of reasonably constant warmth used in the heating cycle evaporator in a heat pump.
A large metallic object that helps to cool devices by increasing their effective surface area.
Often used in electronics where it is necessary to keep heat from sensitive circuit parts during soldering, this metal shape has good heat conductivity to draw heat away from an area.
A device that radiates or draws heat away from a source, such as a transistors or power diode. Heat sinks are used to increase effective surface area, which increases heat radiating capability, of components. Heat sinks are made of high-thermal-conductivity metals, usually aluminum.
