A situation where a lead or pad was at one point in the soldering process wetted by the solder, but due to extended time or temperature, the presence of intermetallics, volatiles or other causes, has become withdrawn from the wetted surface.
A condition which occurs when molten solder has coated a surface and then recedes, leaving irregularly-shaped globules of solder separated by areas covered with a thin solder film; base metal is not exposed.
A condition that results when molten solder has coated a surface and then receded, leaving irregularly shaped mounds separated by areas covered with a thin solder film and with the base material not exposed.
The molten solder repels on the solder pad or component lead. It usually the affected by poor solder-ability.
A condition that occurs when molten solder has coated a surface and then receded, leaving irregularly shaped mounds of solder separated by areas covered with a thin solder film. Voids may also be seen in the dewetted areas. Dewetting is difficult to identify since solder may be wetted at some locations and base metal exposed at others. Depending on the location, may be caused by excessive heating, inadequate cleaning or over-oxidation of the attachment area.
In fluid mechanics, dewetting is one of the processes that can occur at a solid-liquid or liquid-liquid interface. Generally, dewetting describes the rupture of a thin liquid film on the substrate (either a liquid itself, or a solid) and the formation of droplets. The opposite process - spreading of a liquid on a substrate - is called wetting.