Generally refers to a process for the surface treatment of stainless steels. Material is subjected to the action of an oxidizing solution, usually nitric acid, which augments and strengthens the normal protective oxide film enabling the material to resist corrosive attack. The passivating process also removes foreign substances from the surface which might cause local corrosion.

A protective layer of oxides on the surface of a metal which resists corrosion. This passive oxide layer is the primary reason stainless steels have such excellent corrosion resistance.

The formation of a surface layer that impedes the electrochemical reactions at an electrode.

To make inactive or less reactive. To protect (as a solid-state device) against contamination by coating or surface treatment.

The protection (as of a solid state device) against contamination by coating or surface treatment. Growth of an oxide layer on the surface of a semiconductor to provide electrical stability by isolating the transistor surface from electrical and chemical conditions in the environment.

A chemical treatment given to the galvanized sheet steel to prevent the formation of white rust.

The sealing layer added at the end of the fabrication process (usually silicon dioxide or silicon nitride) to protect against moisture or other contamination that can cause the deterioration of the integrated circuit's electronic properties through chemical action, corrosion, or handling during the packaging process.

A layer of material on a semiconductor die that protects it from external contamination and chemically ties up any unbound charges that may exist on the surface as a result of the discontinuation of the semiconductor crystal at the surface. For silicon devices, the passivation is often a layer of silicon dioxide (Si02) that is formed by oxidizing the surface of the silicon at temperatures around 1000 °C. For gallium arsenide devices, a layer of silicon nitride (Si3N4) is often deposited on the surface of the GaAs for passivation.

is the final layer in a semiconductor device that forms a hermetic seal over the circuitry. Plasma nitride and silicon dioxide are the primary materials used in this process.

the formation of a thin passive film or layer on the surface of a metal or mineral that acts as a protective coat to protect the underlying surface from further chemical reaction. In current-voltage plots of passivation, the current, instead of increasing with voltage, falls to a very small value.

The formation of an insulating layer over the semiconductor surface that acts as a barrier to further oxidation or corrosion.

The technique of providing a protective, isolating coating on the top of a semiconductor device. Usually silicon dioxide is grown to provide this coating, but other materials are also used, such as glass. See glassivation.

In the manufacture of stainless steel interconnect components, a light surface oxidation of the stainless steel material is effected to seal the part against ongoing oxidation from corrosive environmental conditions. In hermetic connector manufacture, finish plating and surface fi nishes for connector bodies and contacts takes place after the exothermic firing process.

protective treatment of ferrous metals by warmth or cold phosphatation before their stake in painting. The passivants agents are generally solutions of acid phosphates of heavy metals.

(1) A reduction of the anodic reaction rate of an electrode involved in corrosion. (2) The process in metal corrosion by which metals become passive. (3) The changing of a chemically active surface of a metal to a much less reactive state. Contrast with activation.

A process in which balls are dipped into acid to clean off any leftover metal shavings; a treatment to render the surface less reactive chemically.

The creation of a passive oxide layer on stainless steel, which is responsible for the high corrosion resistance of stainless steel.

treatment of a metal surfaces to reduce corrosion effects; can be achieved by decreasing the high surface energy of metals and formation of anti-corrosive, stable oxide layers (e.g. with chromium)

Uppermost layer on an IC. Used for circuit protection and cushioning. Typically Nitride, Polyimide, Oxide, or Oxi-Nitride.

Conversion of a metal surface to a less reactive state. A process used to reduce the corrosion rate of metal surfaces.

The process in metal corrosion by which metals become passive. (See passive)

The practice of growing a thin oxide film on the surface of a semiconductor to protect exposed elements from environmental contaminates, thus ensuring the electrical stability of the device.

The final layer in a semiconductor device that forms a hermetic seal over the circuit elements. Plasma nitride and silicon dioxide are the materials primarily used for passivation.

Protection of the junctions and surfaces of solid state electronic components and ICs from harmful environments; most commonly achieved by forming a layer of silicon dioxide on the silicon chip.

When exposed in air, stainless steels passivate naturally (due to the presence of chromium). But the time required can vary. In order to ensure that the passive layer reforms rapidly after pickling, a passivation treatment is performed using a solution of nitric acid and water.

A process which encourages the corrosion resistance of stainless steel by the forming of chrome oxide layer on the steel surface.

Usually a silicon dioxide or silicon nitride layer deposited last to seal the circuit to protect it from moisture and/or contamination.  The passivation layer is patterned and etched to open up on the bonding pads.

A chemical treatment to remove corrodible surface impurities and to provide a protective film. This term is applicable to corrosion resisting balls only.

Metals and alloys are made less corrosive through surface treatment to produce a thin and stable inert oxide layer along all external surfaces. This is called the passive corrosion condition or a passivated implant.

A chemical reaction that eliminates the detrimental effect of electrically reactive atoms on a photovoltaic cell's surface.

The phenomenon by which a metal, although in conditions of thermodynamic instability, remains indefinitely unattacked because of modified or altered surface conditions.

To make a surface less active by the formation of a protective film on that surface.

Passivation is the process of making a material "passive" in relation to another material prior to using the materials together. For example, prior to storing hydrogen peroxide in an aluminium container, the container can be passivated by rinsing it with a dilute solution of nitric acid and peroxide alternating with deionized water. The nitric acid and peroxide oxidizes and dissolves any impurities on the inner surface of the container, and the deionized water rinses away the acid and oxidized impurities.