Physical Vapor Deposition. Deposition method used commonly for metal layers through bombardment of target by gas plasma, often called "Sputtering"
Physical Vapor Deposition. A type of vacuum deposition process where a material is vaporized in a vacuum chamber, transported atom by atom across the chamber to the substrate, and condensed into a film at the substrate's surface. The concept has been stretched to include reactive processes that form a coating compound by bombardment of different species on the substrate's surface, and processes that rely on low pressure plasma interactions for greater energy levels and film density. There are actually several different PVD processes, including: thermal evaporation, electron beam gun, ion plating, sputtering, cathodic arc, and laser ablation.(empty)(empty)
Physical Vapour Deposition. Finest metal particles are shot under vacuum. This creates an unbreakable so-called PVD casing. Can be created in various finishes. Has high corrosion resistance with the durability close to that of a sapphire crystal.
A coating process in which molecules from a solid body of material are dislodged by positively charged particles in an electromagnetic field and deposited onto a substrate. PVD can be used to make electrical contacts and connections, for example.
Physical Vapor Deposition. A process in which metallic metal vapor, such as titanium, is ionized in a plasma and combined with gas ions, such as nitrogen, to form a hard coating on the surface of a tool. The process temperature is usually several hundred degrees lower than is used for CVD, and coatings thickness is usually less than half that of a CVD coating.
Physical Vapor Deposition. A durable zirconium or titanium coating that resists scratches, tarnish, and corrosion.
Physical Vapor Deposition. A modern plating process used in faucet manufacturing. Vaporized zirconium reacts with nitrogen and another special gas to form a durable plated surface.
(Physical Vapor Deposition) A modern plating process used mostly with polished brass or gold finishes on faucets. Vaporized zirconium reacts with nitrogen and another special gas to form a durable plated surface which will not tarnish or discolor.
Stands for Physical Vapor Deposition; PVD is a process that bonds the finish color to the faucet, helping it resist scratches, corrosion and tarnishing.
Physical Vapor Deposition is the deposition of coatings via the physical process of evaporating target material in a coating chamber.
Physical Vapor Deposition. A metal-plating process that uses vaporized zirconium, nitrogen, and other gases to form a durable surface resistant to tarnishing and discoloration. Used with polished brass or gold finishes.
hysical apor eposition: A long-lasting, durable coating of titanium or zirconium usually used on Brass Faucets. Helps prevent scratches.
Physical Vapor Deposition. Method of coating thin watch cases by integrating titanium particles and then depositing gold for color (usually comes in black finish).
hysical apor eposition. A modern plating process used mostly with polished brass or gold finishes on faucets. Vaporized zirconium reacts with nitrogen and other gases to form a very durable surface, which will not tarnish or discolor.
Physical Vapor Deposition (also called sputtering) is a process technology in which molecules of conducting material (aluminum, titanium nitride, etc.) are "sputtered" from a target of pure material, then deposited on the wafer to create the conducting circuitry within the chip.
Physical vapor deposition. Deposition of thin films by physical means as opposed to chemical (like chemical vapor deposition). This is most often used for deposition of metals. The most common form of PVD is sputtering, in which a metal target is exposed to a plasma made from a gas like argon which is not chemically reactive. The excited gas atoms hit the target and knock off metal atoms which deposit onto a wafer placed below, building up the desired metal film.
See physical vapor deposition.
Abbreviation of Physical Vapor Deposition, a plating process consisting of the physical transfer of substance by bombardment of electrons.
Physical Vapor Deposition – surface treatment applied to metal to enable plating to adhere.
See Physical Vapour Deposition
Physical Vapor Deposition. also known as sputtering, is used in a subtractive aluminum manufacturing process to deposit the thin conductive films that wire the transistors together. PVD is also used in a copper damascene manufacturing process to deposit the copper barrier layer (which helps to contain the copper lines in the device) and the copper seed layer (which serves as a nucleation layer on which the copper conductive fill "grows").
Physical Vapor Deposition, or PVD, is a term used to describe a family of relatively low temperature (750° F) vacuum coating processes that involve the generation of positively charged ions through various methods. Reactive gases are introduced into the chamber to create various compounds. The positively charges ions are attracted to a negative bias given to the tool substrates. This attraction results in a dense thin-film layer with an extremely strong physical bond to the tool substrate.
Physical Vapor Deposition (used mostly with polished brass or gold finishes). This is a modern plating process used in faucet manufacturing. Vaporized zirconium reacts with nitrogen and other gases to form a VERY durable plated surface. Unlike former days when polished brass would easily tarnish over time, polished brass finishes with PVD are extremely durable and won't generally tarnish or discolor.
A very durable titanium or zirconium coating that resists tarnish, scratches, and corrosion. It is used mostly to protect faucets with a brass finish.
Physical vapor deposition is the process of depositing a solid material from the vapor phase onto a plastic or metal substrate. The result is a hard, non tarnishing decorative finish with a durability similar to chrome.
