(sc) 1) the deposition of a thin film pattern of conductive material onto a substrate to provide interconnection of electronic components or to provide conductive contacts. 2) the layer of high-conductivity metal used to interconnect devices on a chip. Aluminum is commonly used.
The deposition of a thin film of conductive material on to a wafer or substrate by use of either chemical or physical vapor deposition.
A semiconductor manufacturing process in which a layer of metal, such as aluminum, is placed on the wafer to connect the transistors and diodes within an integrated circuit.