an element of a semiconductor device, which supports a semiconductor chip thereon and electrically connects the semiconductor chip to an external circuit such as a circuit board
a structural element forming a semiconductor package with a semiconductor chip mounted thereon, and performs as a lead for connecting the semiconductor package to an external device and as a frame for supporting the semiconductor chip
To facilitate connections to and from the devices of the package, ICs are connected to lead frames.
A metallic frame containing leads and a base to which an unpackaged integrated circuit is attached. After encapsulation, the outer part of the frame is cut away and the leads are bent into the required shapes.
A sheet metal framework etched to form an array of metal traces (leads). An IC is attached to the lead frame at the innermost portion of the leads, and the outermost portion of the leads is attached to the next level of the assembly. However, lead frames are the basis for molded carrier ring (MCR) and plastic quad flatpack (PQFP) components, while TAB frames are the basis for TAB components.
A metal frame, including the leads of a plastic encapsulated package; the frame holds the leads in place prior to encapsulation and is cut away after encapsulation.
Integrated Circuits (ICs) are connected to lead frames yo facilitate connections to and from the devices of the package.
A stamped or etched metal frame, usually connected to the bonding pads of a die by wire bonding, which provides external electrical connections for a packaged electrical device.