Definitions for "Multichip Module"
A generic name for a group of advanced interconnection and packaging technologies featuring unpackaged integrated circuits mounted directly onto a common substrate.
A hybrid which contain at least two bare die.
A module, or package, capable of supporting several chips on a single substrate. MCMs are differentiated from ‘hybrids' by having a high ratio of active silicon to substrate area. MCM-L = laminate construction, MCM-D = dielectric layer construction. MCM-C = ceramic substrate construction.