Definitions for "Tape Automated Bonding"
Method of attaching drive electronics to display via a flexible polyimide cable with fine pitch wires bonded to the display leads
(see TAB)
The utilisation of a metal or plastic tape material as a support and carrier of a microelectronic component in a gang bonding process.
is a specialized assembly-process technology, which involves the application of components onto a circuit board using temperature and pressure.
A high lead count SMT integrated circuit package aimed at very high volume products and specialized low volume products, requiring secondary processing with specialized machinery.