Definitions for "Ball Grid Array"
Keywords:  bga, solder, pga, grid, array
A multi-contact SMT device soldered to a circuit board with solder balls.
(BGA) Type of chip package. An integrated circuit surface-mountpackage with an area array of solder balls that are attached to the bottom side of a substrate with routing layers.
an integrated circuit surface mount package with an area array of solder balls that are attached to the bottom side of a substrate with routing layers. The die are attached to the substrate using die and wire bonding or flip-chip interconnection. Also called land grid array, pad grid array, or pad-array carrier.