Definitions for "Flip Chip"
Keywords:  bump, solder, unpackaged, upside, die
A method for electrically interconnecting unpackaged die active side down with a conductive bump to the substrate
A leadless structure that is electrically and mechanically connected to the substrate via contact lands or solder bumps.
Flip chip interconnect technology pertains to the mounting of a chip with its active side facing the substrate.
A monolithic IC packaging technique that eliminates the need for bonding wires.