A generic term used to describe small gold bars, (usually less than 50 grams). So-called because they are thin and resemble a wafer biscuit.
The substrate made usually from semiconductor material, such as silicon, that is used as the foundation to build IC's on
Halbleiterscheibe, auf der ICs produziert werden. Wird anschliessend geschnitten ("dicing"), um einzelne ICs zu erhalten.
It is a thin slice of semiconductor which is used as a base material to form single transistors or integrated-circuit.
A thin sheet of semiconductor material made by mechanically sawing it from a single-crystal or multicrystal ingot or casting.
A thin disk (or slice) of silicon on which many separate chips can be fabricated and then cut into individual die.
A slice of semiconductor material upon which monolithic ICs are produced.
A thin sheet of semiconductor (photovoltaic material) made by cutting it from a single crystal or ingot.
Silicon disk on which the different processing steps of the semiconductor fabrication process are applied.
a flat thin slice As technology advances, the diameter of the wafers used in the manufacture of semi-conductors increases.
a small thin crisp cake or cookie
thin disk of unleavened bread used in a religious service (especially in the celebration of the Eucharist)
a basic "building block" upon which numerous processing actions take place to produce semiconductor devices
a basic component for semiconductor products
a piece of silicon used to fabricate semiconductor chips
a thin circular slice of semiconductor material, often silicon, used to make semiconductor devices and integrated circuits
a thin slice of a semiconductor (as silicon) used as a base for an electronic component or circuit
a thin slice of silicon with semi conductor properties, and is the key component in a solar cell, which convert sunlight into electricity
a very thin slice of polished silicon and looks similar to a CD-ROM disk
A thin disk of unleavened bread used in the Communion.
thin (thickness depends on wafer diameter, but is typically less than 1 mm), circular slice of single-crystal semiconductor material cut from the ingot of single crystal semiconductor; used in manufacturing of semiconductor devices and integrated circuits; wafer diameter may range from 25 mm to 300 mm; learn more.
A slice of semiconductor crystal ingot used as a substrate for transistors, diodes, and monolithic integrated circuits.
Semiconductor substrate upon which multiple die are fabricated; a thin slice with parallel faces cut from a semiconductor crystal.
A disc of semiconductor material. The chips used in smart cards are delivered to the card maker in wafers.
A thin, usually round slice of material, usually silicon, which is the substrate on which chips are made.
All semiconductor devices are fabricated on wafers. Round wafers are used in order to simplify automated handling during manufacturing. CCDs are typically fabricated on 4", 5", or 6" wafers. The semiconductor industry as a whole is currently moving toward 8" wafers, although one day wafers will be as large as an LP or record (12" in diameter)! The larger the wafer, the larger the number of devices that can fit on one wafer--thus reducing manufacturing costs.
A polished slice cut from a drawn cylinder of monocrystalline silicon, and the starting point in chip manufacture. A wafer is less than 1 mm thick and may have a diameter between 25 and 300 mm, depending on the material involved.
A thin slice of semiconducting material, such as a silicon crystal, upon which microcircuits are constructed by diffusion and deposition of various materials. See blank.
Raw material for a solar cell, a thin sheet of crystalline semiconductor material is made by mechanically sawing it from a single-crystal boule or by casting it.
This refers to a flat round piece of silicon that is used in the manufacture of microprocessors. Fabrication plants, or fabs, typically will take a wafer and carve many several microprocessors into it. Over the years, wafer size is increasing, so that more chips can be fit on a single wafer. Wafers are created by taking a cylinder of silicon and slicing it - much like taking a loaf of bread, and cutting slices - but to much more precise measurements.
A thin section of semiconductor material made by slicing it from a single crystal or rod.
Round disc of pure silicon that is used in manufacturing integrated circuit
A disk of semiconductor material that forms the base on which a number of identical integrated circuits are built. In some cases, two or more designs may be built on the same wafer. In most facilities, five or more wafers are brought through each fabrication step simultaneously in a group known as a wafer lot.
A thin disk of crystal semiconductor, usually silicon-based, upon which chips are fabricated. Extremely thin (1/50th of an inch) and usually only four or five inches in diameter.
A small thin circular slice of a semiconducting material, such as pure silicon or quartz, on which an integrated circuit can be formed.
A round flat disk most often made of silicon that is patterned with several die by semiconductor thin-films processing. Each wafer has a flat or notch cut into its edge to help with aligning or orienting the wafer.
Thin, round, flat piece of silicon that is the base of most integrated circuits.
A thin, right cylindrical section slice of a semiconductor ingot or boule, from which discrete semiconductors or integrated circuits are manufactured. For RF/microwave devices, a wafer is typically 4 - 6 inches or 100 - 200 mm in diameter, and from 0.005 to 0.030 inches thick.
a round disc of semiconductor material most commonly Silicon, although Gallium Arsenide and other semiconductor materials are also used. Wafers are a few millimeters thick and are available in a variety of diameters with 100 millimeter, 125 millimeter, 150 millimeter and 200 millimeter being the most common and 300 millimeter just entering use. Many Integrated Circuits are simultaneously fabricated on wafers during the wafer fabrication process.
The thin, circular slice of pure silicon on which semiconductors are built.
the bread part of the Lord's Supper; often an unleavened, thin cracker; sometimes the wafer is imprinted with a cross; some wafers are large, being several inches in diameter
A slice from an ingot (material prepared by solidification from a melt) on which semiconductor devices are made.
1. Semiconductor wafers are made of round, thin slices of single-crystal silicon and form the base substrate for semiconductor processing.
When most semiconducting material is purified, it comes out in long sausages between 1 and 8 inches in diameter, which are then sliced into wafers, roughly 1 millimeter thick. The wafer is then used as the substrate for forming semiconductor devices.
Thin circular cutout from silicon crystal where a matrix and chips are etched. The most ubiquitous size is 200mm or 8 inchs. A technological transition is underway towards 300mm or 12 inchs. 300mm is used for the most advanced integrated circuits and those for which the line width is inferior to 110nm.
A flat, thin piece of semiconductor material used in the construction of a chip. A wafer goes through a series of photomasking and etching steps to produce the final chip,which has leads attached and ... more
In cooking, a wafer can refer to a crisp, sweet, very thin, flat, and dry cake that is often used to decorate ice cream. Wafers can also be made into cookies with cream flavoring sandwiched between them. They frequently have a waffle surface pattern.
