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Definitions for
"DIE BONDING"
Keywords:
substrate
,
bonder
,
leadframe
,
chip
,
unprotected
Related Terms:
Die attach
,
Chip on board
,
Substrate
,
Cob
,
Tape automated bonding
,
Chip-on-board
,
Leadframe
,
Tab
,
Multichip module
,
Silicon wafer
,
Mcm
,
Flip chip
,
Flip-chip
,
Photomask
,
Wafer
,
Stepper
,
Metalization
,
Solder mask
,
Lead frame
,
Flexible printed circuit
,
Hybrid
,
Bare die
,
Smobc
,
Bonding pad
,
Surface mount technology
,
Die
,
Bump
,
Printed circuit board
,
Plcc
,
Soi
,
Smt
,
Pad
,
Thin film
,
Printed circuit
,
Ball grid array
,
Circuit board
,
Chip carrier
,
Chip
,
Foundry
,
Wave soldering
,
Photolithography
,
Trace
,
Solder paste
,
Ltps
,
Bga
,
Fabless
,
Mask
,
Via
,
Surface mount
Process of mounting a chip to a package.
interfacebus.com
A die bonder machine affixes bare, unprotected semiconductors (chips) to a carrier substrate using solder or epoxy adhesive.
unaxis.com
The attachment of an integrated circuit chip to a substrate or header.
interfacebus.com
The attachment of an IC chip to a substrate.
e-teknet.com
the process of attaching a die down to an underlying substrate, most commonly a leadframe.
icknowledge.com
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Keywords:
bonding
,
see
see Bonding, Die
flextech101.com