Definitions for "DIE ATTACH"
Keywords:  epoxy, esec, ausi, leadframe, eutectic
Bonding of die to a substrate or package.
The technique of mounting chips to a substrate. Methods include AuSi eutectic bonding, various solders, and conductive (and nonconductive) epoxies.
A market sector served by the Assembly & Packaging division (ESEC). Also, a collective term for die bonding and flip chip bonding – two core technologies in the semiconductor industry.
Keywords:  bonder
(DA) Die Bonder