A method of soldering components to printed circuit boards by moving the boards over a continuously flowing and circulating wave of molten solder in a solder bath. The process permits precise control of the depth of immersion in the molten solder and minimises heating of the board. SMDs are held in place during wave soldering with adhesives and are mounted on the secondary side (wave side) of the PCB.
Technique employing a wave of molten solder over which the circuit is passed.
An automatic soldering method whereby the molten solder is pumped from a reservoir through a spout to form a head or wave. The board is then passed over the wave by a conveyor.