(COB) A hybrid technology that exclusively employs face-up-bonded chip devices interconnected to the substrate in a conventional manner, i.e., by flying wires. A generic term for mounting an unpackaged silicon die directly onto the PCB.
One of many configurations in which a semiconductor die (chip) is attached directly to an organic board such as epoxy fibreglass. A number of passive components, such as capacitors, are usually mounted on the same board.
Silicon die is directly attached to the printed circuit board using wire bonds.
An unpackaged silicon die mounted directly on the printed circuit board and connected with wire bonds.