rectangular or square package with I/O connections on all four sides. On leadless versions, the I/O connections consist of metallized terminations. On leaded versions, the leads are attached to the side of the package.
A low profile surface-mount component package, usually square, whose conductor chip cavity or mounting area is a large fraction of the package size and whose external connections are usually on all four sides of the package. It may be leaded or leadless.
A special type of enclosure or package to house a semiconductor device or a hybrid microcircuit and which has metallised castellations as usually electrical terminations around its perimeter, as well as solder pads on its underside, rather than an extended lead frame or plug-in pins.