Ball Grid Array. Designed by Motorola, the land grid array is basically pin-grid array with solder bumps instead of leads. The over-molded, surface-mount package, dubbed OMPAC, mounts a single chip onto a small laminate substrate that has solder balls on its underside.
Ball Grid Array. A component whose terminations are on the bottom of the package, and are in the shape of solder balls and in a grid array pattern. This generally covers components that have them in a full array or in a partial array with “missing” balls in the center.
Ball Grid Array. an integrated circuit surface mount package with an area array of solder balls that are attached to the bottom side of a substrate with routing layers. The die are attached to the substrate using die and wire bonding or flip-chip interconnection. Also called land grid array, pad grid array, or pad-array carrier.
A type of packaging known as ball grid array, where the chip is placed on top of a laminate substrate that has a grid of solder balls underneath connecting the packaged device to a printed circuit board.
Ball Grid Array. A packaging technology similar to a pad grid array, in which a device's external connections are arranged as an array of conducting pads on the base of the package. However, in the case of a ball grid array, small balls of solder are attached to the conducting pads.
Ball Grid Array. As opposed to a pin grid array, a ball grid array is a type of microchip connection methodology. Ball grid array chips typically use a group of solder dots or, balls, arranged in concentric rectangles to connect to a circuit board. BGA chips are often used in mobile applications where PGA chips would take up too much space due to the length of the pins used to connect the chips to the circuit board.
Ball Grid Array (BGA) is a package used for VLSI chips intended for surface mounting on PCBs. BGAs provide higher pin counts and a robust "ball" structure that integrates seamlessly into the manufacturing process.
Ball Grid Array, a type of surface mount packaging. Used for integrated circuits, the device has a grid of pads, with balls solder, that will attach to a printed circuit board through a specialised soldering process.
Ball Grid Array. BGA is descended from pin grid array (PGA), which is a package with one face covered (or partially covered) with pins in a grid pattern. The pins are used to conduct electrical signals from the integrated circuit to the printed circuit board (PCB) it is placed on. In a BGA, the pins are replaced by balls of solder stuck to the bottom of the package. The device is placed on a PCB that carries copper pads in a pattern that matches the solder balls. The assembly is then heated, causing the solder balls to melt. Surface tension causes the molten solder to hold the package in alignment with the circuit board, at the correct separation distance, while the solder cools and solidifies.
BioGraphical Ancestry. DNA test to determine percentages of African, Indo-European, East Asian, and Native American ancestry. (Results example: 98% European, 2% Sub-Saharan African, 0% East Asian, 0% Native American.)