Surface Mount Technology, whereby electronic components are machine-mountable to the surface of printed circuit boards.
SMT stands for urface ount echnology. This is the term for components which are soldered to the surface of a PCB, rather than having their pins/leads pushed through holes within it.
A technique for populating hybrids, multichip modules, and circuit boards, in which packaged components are mounted directly onto the surface of the substrate. A layer of solder paste is screen printed onto the pads and the components are attached by pushing their leads into the paste. When all of the components have been attached, the solder paste is melted using either reflow soldering or vapor-phase soldering.
Silicon Microstrip Tracker. The high-precision innermost element of the DØ tracking system. This is comprised of barrel and disk assemblies of silicon wafers (and mechanical support).
Surface Mount Technology. Defines the entire body of processes and components which create printed circuit board assemblies with lead less components.
Surface mount technology. A technique of assembling SMDs or SMCs on the surface of PCBs and PWAs, as opposed to wiring them through holes. Surface mount technology offers a number of important advantages, but also some disadvantages, such as difficulty in defluxing under certain types of SMD.
Surface mount technology. An assembly process in which electonic components such as semiconductors, resistors and capacitors are attached to the surface of a substrate instead of having leads or pins that extend through holes in the substrate.
Surface Mount Technology. A method of assembling hybrid circuits and printed wiring boards where component parts are mounted onto, rather than into, the printed-wiring boards, as in the mounting components on substrates in hybrid technology.
Surface Mount Technology using leaded and leadless electronic components.
Surface Mount Tech Mounting components on the surface
An abbreviation for surface-mount technology. Learn more about SMT...
Surface Mount Technology. PCBA technology making using of unleaded components.
Surface Mount Technology. Defines the entire body of processes and components that create printed circuit board assemblies with leadless components.
Surface Mount Technology (components are soldered over the conductor board (mostly PCB), without having to drill a hole in the circuit board. (Through Hole)
Surface Mount Technology (Bauteile werden auf die Leiterplatte (meist PCB) aufgelötet, ohne dass Löcher in die Platine gebohrt (Through Hole) werden müssen.)
Surface Mount Technology. The process of assembling printed circuit boards with components soldered to the surface rather than fastened to printed circuit board through-holes.
Surface Mount Technology. is the principal technology for the assembly of printed circuit boards by soldering electrical components directly to a board substrate that uses less space than the pin-through-hole method. SMT is a highly flexible technology that can be continually reconfigured to meet customer-specific product requirements. Each SMT assembly line is designed to have PCB screen printing, component placement and solder reflow capabilities.
Surface Mount Technology. The technology used to manufacture electronic assemblies using com0ponents that are soldered directly to the surface of the substrate or PWB.
Surface Mounted Technology. A method of bonding components onto a PC board without having to drill holes in the PC board. This method allows for smaller size PC boards, faster more automated production, and less expensive devices when built in volume. (7/96)
Surface Mount Technology. A manufacturing process that attaches components on the surface of the printed circuit board, rather than inserting components into plated through hole.
surface - mount technology or surface - mount toroidal
Surface Mount Technology. Components are mounted directly on to printed circuit boards rather than by wires passing through holes. Most modern printed circuit boards will use SMD technology.
"Surface mount technology" refers to a PWB on which components are soldered or mounted on the exterior surface of the board only - an emerging technology.
Surface Mount Technology (SMT) allows components to be placed on the surface of the PCB rather than with leads through holes. Component placement and soldering processes may be entirely automatic, thereby reduces costs.
Abbreviation for surface-mount technology. An electronics manufacturing technique.