Definitions for "Bonding pad"
Keywords:  pad, semiconductor, die, flipchip, asic
the retentive portion of a fixed orthodontic attachment which locks it mechanically to the bonding material; the pad usually has a fine mesh surface
Metallized areas on the surface of a semiconductor device, wafer, or die, to which electrical leads may be connected or probes applied. Also referred to as bonding area.
A metallised area at the end of a thin metallic strip to which a connection is to be made.